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Direct wafer exposure

Authors
Journal
Microelectronics Journal
0026-2692
Publisher
Elsevier
Publication Date
Volume
10
Issue
2
Identifiers
DOI: 10.1016/s0026-2692(79)80058-0

Abstract

The semiconductor industry is moving towards one and half-micron circuits, always supposing the manufacturing technologies are adequate. This paper examines the merits of photolithography, electron beam microlithography, deep ultra-violet and X-ray microlithography as methods of producing these sub-micron devices.

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