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3-D System-on-System (SoS) Biomedical-Imaging Architecture for Health-Care Applications.

Authors
  • Sang-Jin Lee,
  • Kavehei, O
  • Yoon-Ki Hong,
  • Tae Won Cho,
  • Younggap You,
  • Kyoungrok Cho,
  • Eshraghian, K
Type
Published Article
Journal
IEEE transactions on biomedical circuits and systems
Publication Date
Dec 01, 2010
Volume
4
Issue
6
Pages
426–436
Identifiers
DOI: 10.1109/TBCAS.2010.2079330
PMID: 23853380
Source
Medline
Language
English
License
Unknown

Abstract

This paper presents the implementation of a 3-D architecture for a biomedical-imaging system based on a multilayered system-on-system structure. The architecture consists of a complementary metal-oxide semiconductor image sensor layer, memory, 3-D discrete wavelet transform (3D-DWT), 3-D Advanced Encryption Standard (3D-AES), and an RF transmitter as an add-on layer. Multilayer silicon (Si) stacking permits fabrication and optimization of individual layers by different processing technology to achieve optimal performance. Utilization of through silicon via scheme can address required low-power operation as well as high-speed performance. Potential benefits of 3-D vertical integration include an improved form factor as well as a reduction in the total wiring length, multifunctionality, power efficiency, and flexible heterogeneous integration. The proposed imaging architecture was simulated by using Cadence Spectre and Synopsys HSPICE while implementation was carried out by Cadence Virtuoso and Mentor Graphic Calibre.

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