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3-D Self-Assembled Soi Mems: An Example of Multiphysics Simulation

Authors
  • Mendez, C.
  • Louis, C.
  • Paquay, S.
  • De Vincenzo, P.
  • Klapka, I.
  • Rochus, V.
  • Iker, F.
  • André, Nicolas
  • Raskin, J. -P.
Type
Published Article
Publication Date
Nov 21, 2007
Submission Date
Nov 21, 2007
Identifiers
arXiv ID: 0711.3277
Source
arXiv
License
Unknown
External links

Abstract

MEMS devices are typical systems where multiphysics simulations are unavoidable. In this work, we present possible applications of 3-D self-assembled SOI (Silicon-on-Insulator) MEMS such as, for instance, thermal actuators and flow sensors. The numerical simulations of these microsystems are presented. Structural and thermal parts have to be strongly coupled for correctly describing the fabrication process and for simulating the behavior of these 3-D SOI MEMS.

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