A fundamental limitation of screen printing is the achievable alignment accuracy and resolution. This paper presents details of a thick-resist process that improves both of these factors. The technique involves exposing/developing a thick resist to form the desired pattern and then filling the features with thick film material using a doctor blading process. Registration accuracy comparable with standard photolithographic processes has been achieved resulting in minimum feature sizes of <50 μm and a film thickness of 100 μm. Piezoelectric elements have been successfully poled on a platinised silicon wafer with a measured d 33 value of 60 pCN−1.