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Effective diffusivity of lead free solder alloys

Authors
Journal
Computational Materials Science
0927-0256
Publisher
Elsevier
Publication Date
Volume
47
Issue
1
Identifiers
DOI: 10.1016/j.commatsci.2009.06.015
Keywords
  • Monte Carlo
  • Effective Diffusivity
  • Lead Free Solder Alloys
  • Multi-Scale Modeling
Disciplines
  • Computer Science

Abstract

Abstract A Monte Carlo simulation based algorithm is developed to compute the effective diffusivity of lead free solder alloys. Simulations are performed to determine the vacancy diffusivity for 95.5Sn–4.0Ag–0.5Cu (SAC405) solder alloy for different paths. Temperature and micro-structural influence on diffusivity are studied. A map of diffusivity versus temperature and average grain size is developed. Significant differences between diffusivity values reported in the literature for the same solder alloy is also discussed.

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