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Sulfur and superplasticity in electrodeposited ultrafine-grained Ni

Authors
Journal
Materials Science and Engineering A
0921-5093
Publisher
Elsevier
Publication Date
Volume
395
Identifiers
DOI: 10.1016/j.msea.2004.12.025
Keywords
  • Superplasticity
  • Nanomaterials
  • Grain Boundaries
  • Nickel
  • Electrodeposition

Abstract

Abstract The effect of sulfur (S) on superplasticity in ultrafine-grained electrodeposited nickel (Ni) was investigated by comparing the tensile behavior of Ni containing co-deposited S to electrodeposited Ni without S. Superplasticity was observed in Ni containing S in the temperature range of 350–490 °C, at an optimum constant strain rate of 10 −3 s −1. Superplasticity was not achieved in Ni without S. The role of S on superplasticity was attributed to the combined effect of solute drag inhibited grain growth and the promotion of grain boundary sliding through weakened Ni Ni bonds across S enriched grain boundaries.

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