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High power LED package with vertical structure

Authors
Journal
Microelectronics Reliability
0026-2714
Publisher
Elsevier
Volume
52
Issue
5
Identifiers
DOI: 10.1016/j.microrel.2011.07.064
Disciplines
  • Design
  • Mathematics

Abstract

Abstract A LED package structure with vertical geometry of W5II is proposed for high power optoelectronic semiconductor devices. To provide an efficient and easy method of assembling high-power LEDs to sockets of the fixtures, a vertical design referenced from the typical Edison screw base found in US-based lamp systems is used in the structure. The thermal simulation of the structure, fabrication processes and thermal characteristic are evaluated. Thermal resistance measurements are performed to characterize the thermal performance of W5II, and the optical and electrical characteristics of W5II are also verified. The good heat dissipation of W5II could be utilized to enhance the reliability and thermal fatigue capability of high-power LED packages.

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