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Acoustic Patterning for 3D Embedded Electrically Conductive Wire in Stereolithography.

Authors
  • Yunus, Doruk Erdem1
  • Sohrabi, Salman1
  • He, Ran1
  • Shi, Wentao2
  • Liu, Yaling1, 2
  • 1 Department of Mechanical Engineering & Mechanics, Lehigh University, Bethlehem, PA 18015, USA.
  • 2 BioEngineering Program, Lehigh University, Bethlehem, PA 18015, USA.
Type
Published Article
Journal
Journal of Micromechanics and Microengineering
Publisher
IOP Publishing
Publication Date
Apr 01, 2017
Volume
27
Issue
4
Identifiers
PMID: 30344375
Source
Medline
Keywords
Language
English
License
Unknown

Abstract

In this paper, we reported a new approach for particle assembly with acoustic tweezer during three-dimensional (3D) printing for the fabrication of embedded conductive wire with 3D structures. A hexagon shaped acoustic tweezer was incorporated with Digital Light Processing (DLP) based stereolithography (SLA) printer to pattern conductive lines via aligning and condensing conductive nanoparticles. The effect of filler content on electrical resistivity and pattern thickness were studied for copper, magnetite nanoparticles, and carbon nanofiber reinforced nanocomposite samples. The obtained data was later used to produce examples of conductive 3D microstructures and embedded electronic components by using the suggested method.

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