Acoustic Patterning for 3D Embedded Electrically Conductive Wire in Stereolithography.
Department of Mechanical Engineering & Mechanics, Lehigh University, Bethlehem, PA 18015, USA.
BioEngineering Program, Lehigh University, Bethlehem, PA 18015, USA.
- Published Article
Journal of Micromechanics and Microengineering
- Publication Date
Apr 01, 2017
In this paper, we reported a new approach for particle assembly with acoustic tweezer during three-dimensional (3D) printing for the fabrication of embedded conductive wire with 3D structures. A hexagon shaped acoustic tweezer was incorporated with Digital Light Processing (DLP) based stereolithography (SLA) printer to pattern conductive lines via aligning and condensing conductive nanoparticles. The effect of filler content on electrical resistivity and pattern thickness were studied for copper, magnetite nanoparticles, and carbon nanofiber reinforced nanocomposite samples. The obtained data was later used to produce examples of conductive 3D microstructures and embedded electronic components by using the suggested method.
Report this publication
From MEDLINE®/PubMed®, a database of the U.S. National Library of Medicine.
This record was last updated on 12/31/2019 and may not reflect the most current and accurate biomedical/scientific data available from NLM.
The corresponding record at NLM can be accessed at https://www.ncbi.nlm.nih.gov/pubmed/30344375