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Reliability issues of e-Cubes heterogeneous system integration

Authors
Journal
Microelectronics Reliability
0026-2714
Publisher
Elsevier
Publication Date
Volume
48
Identifiers
DOI: 10.1016/j.microrel.2008.06.023
Disciplines
  • Design

Abstract

Abstract The fast development of device fabrication technology stimulates new challenging technology development and progress in wafer processing, module interconnections and packaging technology. Apart from a broad hardware experience, standalone software design simulations before a hardware fabrication are a necessity. This paper discusses software issues of the design and an experimental attempt to the device description and the device description data transfer.

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