This paper discusses a new approach to adhesive microbonding which can overcome restrictions or drawbacks of the conventional MEMS bonding techniques. The main advantages of this technique are: low process temperature, multi material applicability, partial reversibility and partial biocompatibility. In proposed technique, the adhesive is deposited on the substrate and the micro-component is brought and placed at the requested position. Afterwards, the stream of hot air is applied in order to soften the glue and to emboss the micropart. After cooling down at room temperature, the glue hardens and final bond is achieved.