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Influence of oxygen partial pressure on the glow discharge characteristics during DC reactive magnetron sputtering

Authors
Publisher
Elsevier
Publication Date
Keywords
  • Instrumentation And Applied Physics (Formally Isu)

Abstract

Reactive sputtering is a complex process involving different parameters for control The reactive gas content in the system plays a dominant role in controlling other deposition parameters. The influence of oxygen partial pressure on the cathode potentials during reactive magnetron sputtering of copper has been investigated. Based on the results obtained, a new model of reactive magnetron sputtering has been suggested.

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