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Influence of oxygen partial pressure on the glow discharge characteristics during DC reactive magnetron sputtering

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  • Instrumentation And Applied Physics (Formally Isu)


Reactive sputtering is a complex process involving different parameters for control The reactive gas content in the system plays a dominant role in controlling other deposition parameters. The influence of oxygen partial pressure on the cathode potentials during reactive magnetron sputtering of copper has been investigated. Based on the results obtained, a new model of reactive magnetron sputtering has been suggested.

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