Affordable Access

Publisher Website

Cu diffusion in Ag-plated Cu leadframe packages

Authors
Journal
Microelectronics Reliability
0026-2714
Publisher
Elsevier
Volume
52
Issue
7
Identifiers
DOI: 10.1016/j.microrel.2012.02.022

Abstract

Abstract Cu diffusion onto an Ag-plated Cu leadframe surface was detected by Energy Dispersive X-ray (EDX) after de-capsulating the molded package. However, no Cu was detected by EDX on the Ag surfaces of bare leadframe, leadframe after die attachment including die attachment curing, or leadframe after wire bonding. Temperature simulation of molding and post-molding curing show that the temperature and its duration have some impact on the Cu diffusion, which is as expected. Interestingly, this study shows that the Cu diffusion onto the interface of the Ag-plated surface and mold compound is very much dependent on the type of mold compound used, which has never been reported in the literature so far. The Cu diffusion was detected by EDX only for certain types of mold compounds used. It is concluded that the mold compound is a major contributor to the Cu diffusion observed. This is possibly because S and O in the mold compound react with Cu and form copper sulfides and copper oxides, which accelerate the Cu diffusion from the Cu leadframe substrate onto the interface of the Ag surface and mold compound.

There are no comments yet on this publication. Be the first to share your thoughts.

Statistics

Seen <100 times
0 Comments

More articles like this

Growth of tin whiskers for lead-free plated leadfr...

on Microelectronics Reliability Jan 01, 2007

Growth of tin whiskers for lead-free plated leadfr...

on Microelectronics Reliability Jan 01, 2008

Effect of Ag on oxidation of Cu-base leadframe

on Microelectronics Reliability Jan 01, 2011
More articles like this..