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Effects of CMP slurry additives on the agglomeration of alumina nanoparticles 1: General aggregation rate behavior

Authors
Journal
Journal of Colloid and Interface Science
0021-9797
Publisher
Elsevier
Publication Date
Volume
419
Identifiers
DOI: 10.1016/j.jcis.2013.12.029
Keywords
  • Agglomeration
  • Aggregation
  • Nanoparticles
  • Chemical Mechanical Planarization
  • Zeta Potential
  • Isoelectric Point
Disciplines
  • Chemistry

Abstract

Abstract The aggregation behavior for 150nm alumina particles suspended in 1mM KNO3 solutions with various additives used in chemical mechanical planarization of copper was investigated. Three behaviors were observed: no aggregation, reversible aggregation where large agglomerates formed almost instantaneously, and steady aggregation where particle sizes grew over the duration of the measurement. In general steady aggregation occurred at high pH for all suspensions, while no aggregation occurred at acidic pH, except with suspensions with sodium dodecyl sulfate, where reversible aggregation was observed. No aggregation was observed at near neutral pH for all suspensions. Zeta potential and isoelectric points for each suspension were also measured.

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