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Temperature coefficient of resistivity for polycrystalline Cu-films

Authors
Journal
Physics Letters A
0375-9601
Publisher
Elsevier
Publication Date
Volume
62
Issue
7
Identifiers
DOI: 10.1016/0375-9601(77)90088-3

Abstract

Abstract The variation of temperature coefficient of electrical resistivity for polycrystalline copper films with thickness can be explained if temperature variation of the mean free path in a single grain and the scattering of charge carriers at the grain boundary are taken into account.

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