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Impact of copper dummies on interconnect propagation performance in advanced integrated circuits

Authors
Publisher
Elsevier B.V.
Publication Date
Volume
76
Identifiers
DOI: 10.1016/j.mee.2004.07.004
Disciplines
  • Physics

Abstract

Abstract Based on electromagnetic approach and experimental characterization, electrical models of isolated or coupled lines surrounded by dummies are extracted, and a simulation procedure in time domain is performed to obtain signal propagation along interconnects representative of the 90 nm CMOS node. This technique is used to quantify effects of size, shape and placement of dummies on parasitic effects such as delay and crosstalk.

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