Design and characterization of a package-less hybrid PDMS-CMOS-FR4 contact-imaging system for microfluidic integration
Published in Journal of Micro/Nanolithography, MEMS, and MOEMS
We demonstrate a hybrid “package-less” polydimethylsiloxane (PDMS)–complementary metal–oxide–semiconductor (CMOS)-FR4 system for contact imaging. The system embeds the CMOS image sensor directly in a PDMS layer instead of the standard chip package to support microfluidic structures much larger and more complex than those in prior art. The CMOS/PDMS...
