Poorhaydari, Kioumars
Published in
Journal of Materials Engineering and Performance
In this review article, many aspects of high-temperature hydrogen attack of steel are examined in a practical, topic-based format similar to that of API RP 571. This article is a result of reviewing over 220 articles on the subject, published mostly between 1938 and 2020, while some of them were already review articles citing research going back to...
Ye, Chang Zhang, Chaoyi Zhao, Jingyi Dong, Yalin
Published in
Journal of materials engineering and performance
Additive manufacturing (AM) has attracted much attention due to its capability in building parts with complex geometries. Unfortunately, AM metals suffer from three major drawbacks, including high porosity, poor surface finish, and tensile residual stresses, all of which will significantly compromise the fatigue performance. These drawbacks present...
Schumacher, Axel Shah, Vraj Steckemetz, Stefan Dietrich, Georg Pflug, Erik Hehn, Thorsten Knappmann, Stephan Dehé, Alfons Leson, Andreas
Published in
Journal of materials engineering and performance
Aim of this work is to improve the bond between a strain sensor and a device on which the strain shall be determined. As strain sensor, a CMOS-integrated chip featuring piezoresistive sensor elements was used which is capable of wireless energy and data transmission. The sensor chip was mounted on a standardized tensile test specimen of stainless s...
Salahi, Salar Ghaffari, Mahya Nemani, Alireza Vahedi Nasiri, Ali
Published in
Journal of materials engineering and performance
This study aims to investigate the effects of annealing, quenching, and tempering (Q&T) heat treatments on the microstructure, crystallographic orientation, and electrochemical performance of a wall shaped 420 martensitic stainless steel part fabricated by wire arc additive manufacturing technology. The formation of a martensitic matrix with delta ...
Awayes, J. Reinkensmeier, I. Wagner, G. Hausner, S.
Published in
Journal of Materials Engineering and Performance
Thermal joining can lead to high thermal stresses, undesired structural changes, and the associated loss of properties. In the turbine industry, monocrystalline materials are often used to take advantage of their high creep resistance and heat resistance. For process-related reasons, components are mechanically machined, and the contours usually ha...
Janczak-Rusch, Jolanta
Published in
Journal of Materials Engineering and Performance
Politano, O. Rogachev, A. S. Baras, F.
Published in
Journal of Materials Engineering and Performance
Reactive joining with Ni/Al nanocomposites is an innovative technology that provides an alternative to more common bonding techniques. This work focuses on a class of energetic material, produced by high energy ball milling and cold rolling. The initial microstructure is more complex than that of reactive multilayer nanofoils, produced by magnetron...
Hossain, Nayem Chowdhury, Mohammad Asaduzzaman Shuvho, Md Bengir Ahmed Kashem, Mohammod Abul Kchaou, Mohamed
Published in
Journal of materials engineering and performance
3D printing is a popular nonconventional manufacturing technique used to print 3D objects by using conventional and nonconventional materials. The application and uses of 3D printing are rapidly increasing in each dimension of the engineering and medical sectors. This article overviews the multipurpose applications of 3D printing based on current r...
Roustaie, F. Quednau, S. Weißenborn, F. Birlem, O.
Published in
Journal of Materials Engineering and Performance
In this work, we demonstrate on a new interconnection technology which can be used for bonding Flip-Chips with 5-µm-Bumps and fine pitches
Rajendran, Sri Harini Kang, Hyejun Jung, Jae Pil
Published in
Journal of materials engineering and performance
Nanocomposite Sn-Bi solders received noticeable attention for flexible electronics due to their improved mechanical properties. The main limitation is the dispersion of nanoparticles in the solder alloy. Accordingly, in this work, varying additions of ZnO nanoparticles were successfully dispersed into Sn57Bi solder via the liquid-state ultrasonic t...