SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SEMICONDUCTOR PACKAGES
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Applicant
Ltd. Samsung Electronics Co.
Representative
Simon James Mounteney
Application number
EP20198241A1
Kind
A1
Document number
3806137
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SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SEMICONDUCTOR PACKAGES

3806137 - EP20198241A1 - EPO

Application Sep 24, 2020 - Publication Apr 14, 2021

Aenee JANG Younglyong KIM

Abstract

A semiconductor package (10) includes a first semiconductor chip (200) including a first substrate (210) having first and second surfaces opposite to each other, a through electrode (240) in the first substrate, a first chip pad (230) on the first surface and electrically connected to the through electrode, and a second chip pad (231) on the first surface and electrically connected to a circuit element in the first substrate; a redistribution wiring layer (100) on the first surface of the first semiconductor chip, and including a first redistribution wiring line (150a) electrically connected to the first chip pad and a second redistribution wiring line (150b) electrically connected to the second chip pad; a second semiconductor chip (300) stacked on the second surface of the first semiconductor chip and electrically connected to the through electrode; and a molding member (600) on side surfaces of the first and second semiconductor chips.

Description

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