SEMICONDUCTOR MODULE, ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING A SEMICONDUCTOR MODULE
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Applicant
Infineon Technologies Austria AG
Representative
Derek Moore
Application number
EP18158473A1
Kind
A1
Document number
3531446
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SEMICONDUCTOR MODULE, ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING A SEMICONDUCTOR MODULE

3531446 - EP18158473A1 - EPO

Application Feb 23, 2018 - Publication Aug 28, 2019

Danny CLAVETTE Thomas FEIL Carsten VON KOBLINSKI

Abstract

In an embodiment, a module comprises a first electronic device in a first device region and a second electronic device in a second device region. The first electronic device is operably coupled to the second electronic device to form a circuit. Side faces of the first electronic device and of the second electronic device are embedded in, and in direct contact with, the first epoxy layer.

Description

Claims

Patent References

Patent Publication Date Title
US20130140673A1 N/A N/A
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