METHODS FOR MANUFACTURING THREE-DIMENSIONAL ELECTRONIC MODULES, THREE-DIMENSIONAL ELECTRONIC MODULES
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Applicant
Federalnoe Gosudarstvennoe Byudzhetnoe Nauchnoe Uchrezhdenie "Nauchnoproizvodstvennyj Kompleks "Tekhnologicheskij Tsentr"
Representative
Hatice Özlem Sezgin
Application number
EP19813645A1
Kind
A1
Document number
3937213
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METHODS FOR MANUFACTURING THREE-DIMENSIONAL ELECTRONIC MODULES, THREE-DIMENSIONAL ELECTRONIC MODULES

3937213 - EP19813645A1 - EPO

Application Oct 24, 2019 - Publication Jan 12, 2022

Aleksandr Sergeevich BASAEV Aleksandr Nikolaevich SAUROV Vladimir Sergeevich SUKHANOV Sergej Nikolaevich KOZLOV

Abstract

The group of inventions relate to the field of the assembling electronic components into an electronic module by arranging them in three-dimensional space, in particular, to a method of assembling a three-dimensional electronic module. The method of assembling a three-dimensional electronic module is as follows. The functional units are created, the electronic components are implemented mounting onto the technological substrates with contact pads on their side faces. the formed on the substrate functional units are tested. The technological casting tool is prepared for. The functional units are positioned in the technological casting tool placing the technological substrates parallel to each other into technological casting tool and superposing the contact pads. The head-conductive insulating compound is prepared, the compound is filed into the prepared technological casting tool and it is polymerized. The side faces are cutted to open the contact pads of technological substrates.The cleaning procedure of electronic module is carry out. The continuous surface metallization is formed by the screen-printing. Next, A laser is used to form the final individual paths of surface metallization on the side faces. The portions of the conductive paste are locally removed by the laser beam, thereby forming individual metallization paths commutating the necessary contact pads according to the electrical circuit of the three-dimensional electronic module. Also the variants of the method of manufacturing a three-dimensionalelectronic module are declared, in which the surface metallizationis formed by galvanic method and the method of three-dimensional printing, and the three-dimensional electronic modules manufactured by the proposed methods are declared. The technical result is to increase the reliability of three-dimensional electronic modules.

Description

Claims

Patent References

Patent Publication Date Title
RU2312425C1 N/A N/A
RU20071210C1 N/A N/A
RU2492549C1 N/A N/A
WO0159841A N/A N/A
15046277 23/05/2017 Process for Manufacturing a 3d Electronic Module Comprising External Interconnection Leads
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