METHOD FOR MANUFACTURING A POWER MODULE SUBSTRATE
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Grantee
Mitsubishi Materials Corporation
Representative
Hoffmann Eitle
Application number
EP09758435B1
Kind
B1
Document number
2296177
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METHOD FOR MANUFACTURING A POWER MODULE SUBSTRATE

2296177 - EP09758435B1 - EPO

Application Jun 05, 2009 - Publication Apr 14, 2021

KUROMITSU Yoshirou NAGATOMO Yoshiyuki KITAHARA Takeshi TONOMURA Hiroshi AKIYAMA Kazuhiro

Description

Claims

Patent References

Patent Publication Date Title
EP05728866A1 27/12/2006 Al/AlN JOINT MATERIAL, BASE PLATE FOR POWER MODULE, POWER MODULE AND PROCESS FOR PRODUCING Al/AlN JOINT MATERIAL
EP00111125A2 29/11/2000 Circuit substrate
JP8255973A N/A N/A
JPH08255973A N/A N/A
JP2001010874A N/A N/A
JP2001085808A N/A N/A
JPH3234045B N/A N/A
EP05728866A1 27/12/2006 Al/AlN JOINT MATERIAL, BASE PLATE FOR POWER MODULE, POWER MODULE AND PROCESS FOR PRODUCING Al/AlN JOINT MATERIAL
JPH08255973A N/A N/A

Other References

  • University Of Southampton ET AL: "Hypo- eutectic alloys", , 4 June 2008 (2008-06-04), XP055501145, Retrieved from the Internet: URL:https://web.archive.org/web/2008060411 3818/https:/www.southampton.ac.uk/~pasr1/h ypo.htm [retrieved on 2018-08-21]
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